Announcing The Dieline Conference Papercraft Challenge!
by Diane Lindquist on 04/15/2013 | 1 Minute Read
Your creativity could win you a free pass to The Dieline Package Design Conference 2013 in San Francisco this June. The Dieline Conference Papercraft Challenge 2013 is a pure design challenge where designers can showcase their package design skills by transforming blank three-dimensional letters or icons with customized art. Projects submitted by the finalists and winner will be featured on TheDieline.com and on screen at The Dieline Package Design Conference held in conjunction with HOW Design Live at the Moscone Center in San Francisco June 22-26, 2013.
The theme of The Dieline Package Design Conference 2013 is ELEVATE. Keynote presentations, seminars and workshops will all focus on elevating package design as an industry, as well as elevating the package designer’s role in the marketing mix. Any designer with an interest in package design may participate in the challenge. To enter, download the templates for either The Dieline icons or the letters E-L-E-V-A-T-E, apply their package design creativity and construct three-dimensional models. Finalists will be voted upon by the packaging design community via social media.
Deadline for entry is May 15, 2013. For complete details on this The Dieline Papercraft Challenge click here.
The first place winner of The Dieline Papercraft Challenge will receive a full registration pass to attend The Dieline Package Design Conference 2013 (Valued at $1295). In addition to a “meet and greet” with The Dieline.com founder Andrew Gibbs at the conference, the winner will be announced in an editorial feature on TheDieline.com. "I am so excited to launch The Dieline Conference Papercraft Challenge,” says Gibbs. “This is a fun challenge for any package designer or aspiring package design to elevate their creativity beyond the typical restraints of a project. There is no brief, no brand, no client; it is a pure creative challenge. I can't wait to see what our readers come up with!"
HOW Design Live takes place June 22-26, 2013 at the Moscone Center in San Francisco, California. It consists of four design conferences: HOW Design Conference, InHOWSE Managers Conference, Creative Freelancers Conference, and The Dieline Package Design Conference. More than 3800 design professionals together will gather for training, professional development and networking with peers at this annual event produced by F+W Media, publishers of HOW Magazine and Print. The Dieline Package Design Conference is produced in partnership with TheDieline.com. For more information and to register for The Dieline Package Design Conference visit www.PackageDesignConference.com.
Don’t dwell on it. Get designing!