The New Forum for Package Design. When putting our thoughts together for The Dieline Forum, we wanted to break away from our flagship conference model and start something new! We created conference that is intimate and fosters an environment for interpersonal communication.
We are excited to announce The Dieline Forum: San Francisco – a day and a half conference designed to foster interaction, discussion, and the exchange of ideas. Specifically designed to cater to a smaller audience, The Dieline Forum will address the concerns of working professionals in the package design industry in a specific regional area. The Dieline Forum is comprised of shorter and direct sessions – with the intended goal being – efficient information. We have also opened the lines of communication via our discussion panels, so no questions or topics are off limits.
