The Dieline Conference: Early Discount Ends Sunday
by First name Last name on 04/29/2011 | 1 Minute Read
This is it! Your last chance to grab the discount early bird rate and save $180! The Dieline Package Design Conference, The Dieline Awards, and The Dieline Expo will be presented in Chicago on June 22-24th as a part of HOW Design Live. Be a part of The Package Design Event of the Year. Spots are filling up FAST, so reserve yours today.
The Dieline Package Design Conference focuses on the specific needs of package designers, from education and inspiration to practical, real-world advice. Join us June 22-24, and you’ll hear from expert package designers, industry experts, explore the year's most successful projects, and learn more about hot topics like the future of food packaging, sustainability, using social media, and decoding package design, and more. Plus you’ll get to connect and network with hundreds of package designers from across the country.