HOW magazine is excited to partner with TheDieline.com in introducing The Dieline Package Design Conference, one of four HOW Design Live events. Focused exclusively on the specialized field of packaging and branding, this conference assembles the “big dogs” of the industry, including Michael Osborne, Joe Duffy, Louise Fili, Moira Cullen and more. Exclusive receptions and your place as a guest at The Dieline Awards ceremony provides you with multiple opportunities to network exclusively with your peers. Plus, we’re assembling a top-notch roster of sponsors and exhibitors at The Dieline EXPO providing you with products and services geared specifically to package designers.
But The Dieline Package Design Conference attendees also get to venture out into the wider design world thanks to HOW Design Live’s unique structure. Four major creative events under one roof means that in addition to packaging-focused sessions, you have access to the HOW Design Live Resource Center, one of the industry’s most extensive sources of cutting-edge products and up-to-the-minute services for creative professionals.
