Get the Best of Both Worlds at The Dieline Conference

by First name Last name on 03/10/2011 | 1 Minute Read

HOW magazine is excited to partner with in introducing The Dieline Package Design Conference, one of four HOW Design Live events. Focused exclusively on the specialized field of packaging and branding, this conference assembles the "big dogs" of the industry, including Michael Osborne, Joe Duffy, Louise Fili, Moira Cullen and more.  Exclusive receptions and your place as a guest at The Dieline Awards ceremony provides you with multiple opportunities to network exclusively with your peers. Plus, we're assembling a top-notch roster of sponsors and exhibitors at The Dieline EXPO providing you with products and services geared specifically to package designers.

But The Dieline Package Design Conference attendees also get to venture out into the wider design world thanks to HOW Design Live’s unique structure. Four major creative events under one roof means that in addition to packaging-focused sessions, you have access to the HOW Design Live Resource Center, one of the industry's most extensive sources of cutting-edge products and up-to-the-minute services for creative professionals.

Join us at the Resource Center Opening on June 24 and be sure to pick up free samples, check out an array of stock photography options and new paper choices, plus try your hand at the newest software. With Resource Center exhibitors including Adobe, Mohawk, Bigstock, The Creative Group, Neenah Paper and more, you'll discover all types of products that will help bring your creative ideas to life. Check out the ever-expanding roster of sponsors and exhibitors here.

Plus, you're invited to attend HOW Design Live’s Opening Keynote and Opening Reception—all included in the price of your The Dieline Package Design Conference registration.

The Dieline Awards:Be on the scene as the winners of the prestigious The Dieline Awards are announced live! 39 winners will be selected across 13 categories covering food, technology, student design and more. Winning entries will be chosen by AIGA president Debbie Millman and a highly esteemed panel of 12 industry experts. 

The Dieline Expo:Meet vendors and discover products geared toward solving your toughest packaging problems. These are the folks who will help you take advantage of all the information you're picking up in your sessions—from using the latest materials to staying ahead of trends. You'll see representatives from Interbrand, Webb deVlam, Allen Field Co, Roland DGA Corporation, Yupo Corporation America, Elmwood Design, and more. 

Speaker Highlight:Sterling Brands’ President of Design—and AIGA President—Debbie Millman has more than two decades' worth of expertise to share at The Dieline Package Design Conference. Put yourself in the same room with her and soak up some branding wisdom!SEE MORE SPEAKERS »

Travel to Chicago:The Dieline Package Design Conference will take place at the Hyatt Regency Chicago, located at 151 E. Wacker Drive, Chicago, IL 60601. We've partnered with the Hyatt Regency and travel providers to provide discounts for you on every leg of your journey. 

Be sure to pencil in some free time to enjoy Chicago's treasure trove of museums, shopping, world-class restaurants, architectural wonders, and more. You'll get plenty of ideas on the travel page

HOW Design Live:The Dieline Package Design Conference is a part of HOW Design Live—the biggest, most significant design event of the year. HOW Design Live showcases four important design events all taking place at the Hyatt Regency Chicago. SEE MORE HOW DESIGN LIVE DETAILS »


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